According to foreign media reports, Apple is committed to designing more chip components internally to replace the components currently purchased by Apple from Broadcom and Skyworks. Bloomberg stated that this new office is still in its early stages, but will ultimately focus on 'wireless radios, RF integrated circuits, and wireless on chip systems', as well as Bluetooth and Wi Fi connected semiconductors. Although the A-series and M-series SoCs have received significant attention in terms of CPU and GPU on the Apple iPhone and Mac, these two devices also contain many other chips for handling power management, USB connections, wireless charging, and more. By disassembling the iPhone13pro into iFixit, Skyworks and Broadcom provide most of the functionality of iPhone third-party lines, and Apple seems more willing to design these components themselves, which can To create more custom solutions.

Apple wants to reduce its reliance on third-party suppliers.

One of the most prominent examples on third-party chips is the iPhone modem, which is currently produced by Qualcomm (but before that, Apple also had a lawsuit dispute where Apple switched to using Intel components). Apple has also made no secret of its ambition to develop 5G chips instead of paying for Qualcomm chips: it is said that Intel acquired Intel's smartphone modem business for approximately $1 billion in 2019 and plans to transfer the business to its own chip business. The home modem will debut the iPhone in 2023.

However, Apple hopes to produce more chips on its own, which may not only be used for higher-level control and hardware integration: it can also better handle component supply. Now, due to component supply issues with suppliers such as Botong, Apple has felt the impact of global chip shortages, which has forced Apple to significantly reduce production targets in October. If Apple can continue to cooperate well with its production partners to manufacture their own chips, it will help Apple solve these problems in the future.